Important Dates

Submission Deadline:

August 31, 2024

Notification of Acceptance:

September 30, 2024

Camera Ready Submission:

October 31, 2024

Registration Deadline:

November 15, 2024

Contact Us

Ms. Shaw Liang

Conference Secretary

The Technical Committee of the 2024 International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS2024) invites the submission of original research papers in the fields of theoretical, experimental, and applied cyber security and information engineering to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented as either oral or poster at the conference. Contributions are sought in the following areas:

Analog, Digital, Mixed, and RF Circuits Design

Low Power Tools and Designs Techniques

Sequential Logic Circuit Design

Design of CMOS Combinatorial Logic Gate CMOS

Memory and Array Structure Design

VLSI Design

Silicon / Germanium Devices and Device Physics

Modeling and Simulation of Organic Semiconductor Devices

Test, Fault Tolerance, Reliability and Modelling

Interconnect, Low K, High K and Other Process Technologies

Integrated Circuits CAD, DFM

Signal De-Noise and Processing and Optimization

Highly Integrated Front-End Circuits and Devices

Integrated Circuits for Communications

Physical Design of Integrated Circuits and Systems

Devices and Circuits for Wireless Systems

Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing

Manufacturing, Processing, Packaging and Testing Technology of Integrated Circuits and Devices

Electronic Design Automation (EDA)

Data Path in Digital Processor Architecture

Embedded / Multiprocessor Systems

Hardware-Software Co-Design and Co-Verification

Important Dates

Last date for paper submission: August 31, 2024

Last date for paper acceptance: September 30, 2024

Last date for registration: November 15, 2024


All accepted and registered papers will be included in International Conference Proceedings, which will be published by ACM, and sent to EI Compendex and Scopus for indexing.

Submission Guidelines

All submissions must be in English with a varying length from 4 to 8 pages including figures and references, adhere to the template format in the conference website, and must be sent to the or For avoiding submit repeatedly, please do select one method only.

Authors must complete their submissions before the designated deadlines. Late submissions will not be considered. The initial and final submissions must be in editable format. Hardcopy is not accepted.

Review Instruction

ICDIS2024 follows the highest standards of publication ethics and takes all possible procedures against any publication misconduct. This Conference does not accept any type of plagiarism, which means that any author replicating a significant part of another's work without acknowledging him/her or passing another's work off as his/her own is not tolerated and not published.

All authors submitting their works to ICDIS2024 for publication as original works confirm that the submitted papers are their own contributions and have not been copied in whole or in part from other works.

Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of each accepted submission. The ICDIS2024 guarantees that the entire peer review and publication process is meticulous and objective. Furthermore, all works not in accordance with these standards will be removed from the publication if malpractice is revealed at any time even after the publication. Every case of suspected plagiarism or duplicate publishing will be reported.


The conference will select Best Paper Award,  Best Presentation Award and Best Poster Award.

Note: The Organizing Committee has the authority to establish additional awards or select multiple recipients for each award following panel discussions. The awards will be announced during the closing ceremony.